YYYY6FEATUREMaximum layercountMaximum workingsizeBoard thicknessMaximum cuthicknessMinimum corethicknessMinimum line/spaceLine width controlLayer registrationDrillingAspect Ratio (PTH)Special supportCopyright (C) 2021 MOLYMER GROUP. All Rights Reserved.STANDARD262 + 16b + 2617 x 541 mm617 x 541 mm0.25 - 5.08 mm0.25 - 2.4 mm3 oz2 oz0.075 mm0.075/0.075 mm0.1/0.1 mm± 15%0.125 mm0.2 mm0.1 mm1:08ADVANCEDMolymerValueconfidentialStandard MLSequentialML + DrillML + Drill to O/L AOIML + DrillML + Drill to O/L AOIInnerlayerOuterlayerInnerlayerOuterlayerMechanicalLaserVia Fill (Conductive & non-conductive)Stacked / Stagged microvias282 + 18b + 2700 x 541 mm630 x 541 mmup to 6.0 mmup to 3.0 mm4 oz3 oz0.05 mm0.05/0.05 mm0.05/0.1 mm± 8%0.075 mm0.15 mm0.075 mm1:10仕様詳細につきましてはお問い合わせください。https://www.emctw.com/en-global/mass_lam_service/indexElite Material シールド板スペック海外基板材料調達
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